Direct nucleation and growth of peritectic phase induced by substantial undercooling condition

被引:28
作者
Zhai, Wei [1 ]
Wei, Bingbo [1 ]
机构
[1] Northwestern Polytech Univ, Minist Educ, Key Lab Space Appl Phys & Chem, Xian 710072, Peoples R China
基金
中国国家自然科学基金; 国家教育部博士点专项基金资助;
关键词
Phase transformation; Microstructure; Crystal growth; Rapid solidification; High undercooling; SOLIDIFICATION; ALLOY; MELTS;
D O I
10.1016/j.matlet.2013.06.084
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Peritectic phase forms through peritectic transformation in most cases. Here we predicted theoretically a growth mechanism transition from peritectic transformation to the direct nucleation and growth of peritectic phase during rapid solidification. To demonstrate this experimentally, liquid Cu-Sn alloy was undercooled by up to 268 K (0.31T(L)). Once the undercooling exceeds a critical value of about 220 K, peritectic eta phase forms directly from the metastable liquid phase by suppressing the nucleation of primary epsilon phase and peritectic transformation. As undercooling increases in the range below 201 K, the primary epsilon phase is refined and peritectic transformation is promoted. (C) 2013 Elsevier B.V. All rights reserved.
引用
收藏
页码:145 / 148
页数:4
相关论文
共 9 条
[1]   Effect of melt convection on the secondary dendritic arm spacing in peritectic Nd-Fe-B alloy [J].
Biswas, K. ;
Hermann, R. ;
Wendrock, H. ;
Priede, J. ;
Gerbeth, G. ;
Buechner, B. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 480 (02) :295-298
[2]   Suppression of peritectic reaction in the undercooled peritectic Fe-Ni melts [J].
Chen, Y. Z. ;
Liu, F. ;
Yang, G. C. ;
Liu, N. ;
Yang, C. L. ;
Zhou, Y. H. .
SCRIPTA MATERIALIA, 2007, 57 (08) :779-782
[3]  
Kurz W, 2005, FUNDAMENTALS SOLIDIF
[4]   SOLIDIFICATION PROGRESS AND HEAT-TRANSFER ANALYSIS OF GAS-ATOMIZED ALLOY DROPLETS DURING SPRAY FORMING [J].
LEE, ES ;
AHN, S .
ACTA METALLURGICA ET MATERIALIA, 1994, 42 (09) :3231-3243
[5]   Non-equilibrium solidification of undercooled Co-Si melts [J].
Leonhardt, M ;
Löser, W ;
Lindenkreuz, HG .
SCRIPTA MATERIALIA, 2004, 50 (04) :453-458
[6]   A band microstructure in directionally solidified hypo-peritectic Ti-45Al alloy [J].
Luo, Wenzhong ;
Shen, Jun ;
Min, Zhixian ;
Fu, Hengzhi .
MATERIALS LETTERS, 2009, 63 (16) :1419-1421
[7]   Formation mechanism of the primary faceted phase and complex eutectic structure within an undercooled Ag-Cu-Ge alloy [J].
Ruan, Y. ;
Dai, F. P. ;
Wei, B. .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2011, 104 (01) :275-287
[8]   Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433-473 K [J].
Takenaka, T ;
Kano, S ;
Kajihara, M ;
Kurokawa, N ;
Akamoto, KS .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 396 (1-2) :115-123
[9]   A DSC analysis of thermodynamic properties and solidification characteristics for binary Cu-Sn alloys [J].
Zhai, W. ;
Wang, W. L. ;
Geng, D. L. ;
Wei, B. .
ACTA MATERIALIA, 2012, 60 (19) :6518-6527