Hybrid Modeling Method for Transient Simulation of Multilayered Power/Ground Planes

被引：0
|
作者：
Watanabe, Takayuki [1 ]
机构：
[1] Univ Shizuoka, Grad Sch Management & Informat Innovat, Suruga Ku, Shizuoka 4228526, Japan
来源：
2012 IEEE 21ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS | 2012年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：288 / 291
页数：4
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