Process Signatures - a new approach to solve the inverse surface integrity problem in machining processes

被引:107
作者
Brinksmeier, Ekkard [1 ]
Klocke, Fritz [2 ]
Lucca, Don A. [3 ]
Soelter, Jens [1 ]
Meyer, Daniel [1 ]
机构
[1] Univ Bremen, Fdn Inst Mat Sci, D-28359 Bremen, Germany
[2] Rhein Westfal TH Aachen, Lab Machine Tools & Prod Engn WZL, D-52056 Aachen, Germany
[3] Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA
来源
2ND CIRP CONFERENCE ON SURFACE INTEGRITY (CSI) | 2014年 / 13卷
关键词
Surface Integrity; Machining; Mechanism; Process Signatures;
D O I
10.1016/j.procir.2014.04.073
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In industrial practice, the generation of a desired surface integrity of high performance components is still an iterative process based on experience. Despite the findings of researchers correlating the process parameters with the resulting surface integrity, until today, it is not possible to deduce the required process parameters from a given desired surface integrity. This inverse problem shall be addressed by a new approach focusing on process-independent correlations between the thermo-mechanical loads within the workpiece material and the resulting material modifications. The concept of Process Signatures, which aggregate information on material modifications caused by the physical conditions to which a material is subjected to on different levels of scale, are a promising strategy to achieve a knowledge-based solution of the inverse surface integrity problem. This paper presents the current understanding regarding the identification of Process Signatures as well as their potential for future application in practice. (C) 2014 The Authors. Published by Elsevier B.V.
引用
收藏
页码:429 / 434
页数:6
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