Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints

被引：13

作者：

Chen, Cai ^{[1
]}

Zhang, Lei ^{[1
]}

Zhao, Jiaxi ^{[1
]}

Cao, Lihua ^{[1
]}

Shang, J. K. ^{[1
]}

机构：

[1] Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2012年 / 41卷 / 09期

关键词：

Solder; size effect; shear strength; microstructure; LEAD-FREE SOLDER; FATIGUE-CRACK INITIATION; SN-AG; NI; CU;

D O I：

10.1007/s11664-012-2156-9

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effect of the gap size on the shear strength of a solder joint was investigated in both Sn/Cu and Sn/FeNi lap solder joints by varying the gap size from 20 mu m to 300 mu m. In the Sn/FeNi joints, the shear strength remained relatively constant, around 14 MPa, independent of the gap size. In contrast, the shear strength of the Sn/Cu joint decreased about 20% from 25 MPa to 20 MPa. The decrease was shown to result from Cu6Sn5 precipitation in the thicker Sn/Cu joint, which was absent in the thinner joints.

引用

页码：2487 / 2494

页数：8

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