Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

被引：17

作者：

Ben Romdhane, E. ^{[1
,2
]}

Guedon-Gracia, A. ^{[2
]}

Pin, S. ^{[1
]}

Roumanille, P. ^{[1
]}

Fremont, H. ^{[2
]}

机构：

[1] Inst Rech Technol St Exupery, 3 Rue Tarfaya, F-31400 Toulouse, France

[2] Univ Bordeaux, IMS Lab, UMR 5218, F-33405 Talence, France

来源：

MICROELECTRONICS RELIABILITY | 2020年 / 114卷

关键词：

Tin compounds - Ball grid arrays - Lead-free solders - Tin alloys - Soldered joints - Soldering - Stresses;

D O I：

10.1016/j.microrel.2020.113812

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The microstructure of lead-free solder joints often consists of only one or a few randomly oriented tin grains as a result of cooling conditions and reactions that take place during the solidification. Due to severe anisotropy of the tin phase and this complex microstructure, the stress state of each joint will be unique, and lead to a dispersion in times to fail. This study aims at evaluating the impact of orientations of tin grains on the stress state of a BGA component. Different combinations of solder joint grain orientations are studied through thermo-mechanical simulations in order to assess the stress state of each joint. A significant effect of neighbouring joints has been observed for the different cases.

引用

页数：6

共 19 条

[1]

Arfaei B., 2013, SMTA INT, P539

[2]

Arfaei B., 2015, FAILURE MECH MICROST, P3

[3]

Arfaei B, 2013, 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), P976, DOI 10.1109/ECTC.2013.6575693

[4] Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints [J].

Bieler, Thomas R. ;

Jiang, Hairong ;

Lehman, Lawrence P. ;

Kirkpatrick, Tim ;

Cotts, Eric J. ;

Nandagopal, Bala .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (02) :370-381

[5]

Gracia A., 2019, STAT STUDY SAC SOLDE

[6]

Henderson D.W., 2004, MICROSTRUCTURE SN NE

[7] Solder joint fatigue models: review and applicability to chip scale packages [J].

Lee, WW ;

Nguyen, LT ;

Selvaduray, GS .

MICROELECTRONICS RELIABILITY, 2000, 40 (02) :231-244

[8] Cyclic twin nucleation in tin-based solder alloys [J].

Lehman, L. P. ;

Xing, Y. ;

Bieler, T. R. ;

Cotts, E. J. .

ACTA MATERIALIA, 2010, 58 (10) :3546-3556

[9]

Lehman LP, 2005, ELEC COMP C, P674

[10] The Stress State of BGA Solder Joints Influenced by the Grain Orientations of Neighboring Joints [J].

Lovberg, Andreas ;

Tegehall, Per-Erik .

2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, :882-889

← 1 2 →