Electrochemical Migration of Lead-free Solder Alloys in Na2SO4 Environment

被引：0

作者：

Medgyes, Balint ^{[1
]}

Adam, Sandor ^{[1
]}

Tar, Lajos ^{[1
]}

Verdingovas, Vadimas ^{[2
]}

Ambat, Rajan ^{[2
]}

Harsanyi, Gabor ^{[1
]}

机构：

[1] Budapest Univ Technol & Econ, Dept Elect Technol, Budapest, Hungary

[2] Tech Univ Denmark, Dept Mech Engn, Mat & Surface Engn, DK-2800 Lyngby, Denmark

来源：

2017 40TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) | 2017年

关键词：

WHISKER GROWTH; TIN;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of 0.1 and 1 mM Na2SO4 solutions X alloy (composition in wt%: Sn=90,95%, Ag=3,8%, Cu=0,7%, Bi=3%, Sb=1,4%, Ni=0,15%) has higher migration susceptibility than SAC305 alloy (composition in wt%: Sn=96,5%, Ag=3%, Cu=0,5%). However on higher concentration levels, MTTF decreased and the failures usually happened in the same time on each solder alloy type. Failures were not happened in the case of X covered boards in case of 10 mM concentration.

引用

页数：6