Electrochemical Migration of Lead-free Solder Alloys in Na2SO4 Environment

被引：0
作者：
Medgyes, Balint [1 ]
Adam, Sandor [1 ]
Tar, Lajos [1 ]
Verdingovas, Vadimas [2 ]
Ambat, Rajan [2 ]
Harsanyi, Gabor [1 ]
机构：
[1] Budapest Univ Technol & Econ, Dept Elect Technol, Budapest, Hungary
[2] Tech Univ Denmark, Dept Mech Engn, Mat & Surface Engn, DK-2800 Lyngby, Denmark
来源：
2017 40TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) | 2017年
关键词：
WHISKER GROWTH; TIN;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of 0.1 and 1 mM Na2SO4 solutions X alloy (composition in wt%: Sn=90,95%, Ag=3,8%, Cu=0,7%, Bi=3%, Sb=1,4%, Ni=0,15%) has higher migration susceptibility than SAC305 alloy (composition in wt%: Sn=96,5%, Ag=3%, Cu=0,5%). However on higher concentration levels, MTTF decreased and the failures usually happened in the same time on each solder alloy type. Failures were not happened in the case of X covered boards in case of 10 mM concentration.
引用
收藏
页数：6
相关论文
共 27 条
  • [21] Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys
    Shalaby, Rizk Mostafa
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 560 : 86 - 95
  • [22] Selective corrosion of ?-Sn and intermetallic compounds in an Ag-Sn alloy at different potentials in NaCl and Na2SO4 solutions
    Dai, Wei
    Liu, Yuanyuan
    Huang, Ningge
    Lan, Rulei
    Zheng, Kangkang
    Lu, Yixing
    Li, Jin
    Jiang, Yiming
    Sun, Yangting
    [J]. CORROSION SCIENCE, 2023, 212
  • [23] Electrochemical migration behavior of Sn-3.0Ag-0.5Cu solder alloy under SO2 polluted thin electrolyte layers
    Liao, Bokai
    Li, Zhen
    Cai, Yu
    Guo, Xingpeng
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (06) : 5652 - 5661
  • [24] Crystal Structure and Luminescence of Sn,I,Cs,Na-Y, a Lead-Free Zeolite Containing Tetrahedrally Distorted Cubes of Sn4I44+
    Lim, Hyeon Seung
    Park, Gi Beom
    Kim, Joon Young
    Kim, Cheol Woong
    Heo, Nam Ho
    Seff, Karl
    [J]. JOURNAL OF PHYSICAL CHEMISTRY C, 2021, 125 (28) : 15696 - 15710
  • [25] Electrochemical Corrosion Behavior of Sn-1.0Ag-0.5Cu and Sn-3.8Ag-0.7cu Lead Free Solder Alloys During Storage and Transportation Under Chloride Working Condition
    Kaushik, Raj Kumar
    Batra, Uma
    Sharma, J. D.
    [J]. TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS, 2022, 23 (04) : 371 - 381
  • [26] Uncovering the Role of Electronic Doping in Lead-free Perovskite (CH3NH3)2CuCl4-xBrx and Solar Cells Fabrication
    Gassara, Mahdi
    Hemasiri, Naveen Harindu
    Kazim, Samrana
    Costantino, Ferdinando
    Naili, Houcine
    Ahmad, Shahzada
    [J]. CHEMSUSCHEM, 2023, 16 (11)
  • [27] Two-Dimensional Lead-Free Perovskite (C6H5C2H4NH3)2CsSn2I7 with High Hole Mobility
    Shen, Hongzhi
    Li, Junze
    Wang, Haizhen
    Ma, Jiaqi
    Wang, Jun
    Luo, Hongmei
    Li, Dehui
    [J]. JOURNAL OF PHYSICAL CHEMISTRY LETTERS, 2019, 10 (01) : 7 - 12
123