Electrochemical Migration of Lead-free Solder Alloys in Na2SO4 Environment

被引：0
|
作者：
Medgyes, Balint [1 ]
Adam, Sandor [1 ]
Tar, Lajos [1 ]
Verdingovas, Vadimas [2 ]
Ambat, Rajan [2 ]
Harsanyi, Gabor [1 ]
机构：
[1] Budapest Univ Technol & Econ, Dept Elect Technol, Budapest, Hungary
[2] Tech Univ Denmark, Dept Mech Engn, Mat & Surface Engn, DK-2800 Lyngby, Denmark
来源：
2017 40TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) | 2017年
关键词：
WHISKER GROWTH; TIN;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of 0.1 and 1 mM Na2SO4 solutions X alloy (composition in wt%: Sn=90,95%, Ag=3,8%, Cu=0,7%, Bi=3%, Sb=1,4%, Ni=0,15%) has higher migration susceptibility than SAC305 alloy (composition in wt%: Sn=96,5%, Ag=3%, Cu=0,5%). However on higher concentration levels, MTTF decreased and the failures usually happened in the same time on each solder alloy type. Failures were not happened in the case of X covered boards in case of 10 mM concentration.
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页数：6
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