Coupling of Morphology and Chemistry Leads to Morphogenesis in Electrochemical Metal Growth: A Review of the Reaction-Diffusion Approach

被引:33
作者
Bozzini, Benedetto [1 ]
Lacitignola, Deborah [2 ]
Mele, Claudio [1 ]
Sgura, Ivonne [3 ]
机构
[1] Univ Salento, Dipartimento Ingn Innovaz, I-73100 Lecce, Italy
[2] Univ Cassino & Lazio Meridionale, Dipartimento Ingn Elettr & Informaz, I-03043 Cassino, Italy
[3] Univ Salento, Dipartimento Matemat & Fis E De Giorgi, I-73100 Lecce, Italy
关键词
Electrodeposition; Electrochemistry; Plating; Corrosion; Mathematical modelling; Reaction diffusion; Pattern formation; Travelling waves; Numerical simulations; AU ELECTRODEPOSITION; IN-SITU; CU; SPECTROSCOPY; GENERATION; FREQUENCY; PARTICLES; DYNAMICS; SCHEMES; MODEL;
D O I
10.1007/s10440-012-9725-z
中图分类号
O29 [应用数学];
学科分类号
070104 ;
摘要
The coupling of surface shape dynamics and surface composition for a material growing by electrodeposition has been found in recent modelling work by the authors, to give rise to a rich morphogenetic scenario. In this paper we concentrate on a systematic description of morphogenesis occurring during metal and alloy electrodeposition. First of all we give a brief presentation of the physical facts relevant to the generation of shapes in electrochemical growth processes, essentially the balance between change-transfer and mass-transport rates. Hence, we review the mathematical modelling work recently published by the authors, based on analytical and numerical studies of a system of reaction-diffusion equations for morphological and adsorption dynamics. Eventually, a selection of examples of experimental validation of the model by means of numerical simulations is proposed.
引用
收藏
页码:53 / 68
页数:16
相关论文
共 20 条
  • [1] High order generalized upwind schemes and numerical solution of singular perturbation problems
    Amodio, P.
    Sgura, I.
    [J]. BIT NUMERICAL MATHEMATICS, 2007, 47 (02) : 241 - 257
  • [2] High-order finite difference schemes for the solution of second-order BVPs
    Amodio, P
    Sgura, I
    [J]. JOURNAL OF COMPUTATIONAL AND APPLIED MATHEMATICS, 2005, 176 (01) : 59 - 76
  • [3] [Anonymous], 2009, Comsol multiphysics 4.3b
  • [4] [Anonymous], PRODUCTS FINISHING M
  • [5] [Anonymous], 2002, MATH BIOL
  • [6] Bicelli LP, 2008, INT J ELECTROCHEM SC, V3, P356
  • [7] Electrochemical fabrication of nano- and micrometric Cu particles: in situ investigation by electroreflectance and optical second harmonic generation
    Bozzini, B.
    D'Urzo, L.
    Mele, C.
    [J]. TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2008, 86 (05): : 267 - 274
  • [8] Au electrodeposition in presence of self-assembling organics: in situ study by sum frequency generation and surface enhanced Raman spectroscopy
    Bozzini, B.
    D'Urzo, L.
    Mele, C.
    Busson, B.
    Tadjeddine, A.
    [J]. TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2010, 88 (03): : 130 - 143
  • [9] Investigation into dynamics of Au electrodeposition based on analysis of SERS spectral time series
    Bozzini, B.
    D'Urzo, L.
    Lacitignola, D.
    Mele, C.
    Sgura, I.
    Tondo, E.
    [J]. TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2009, 87 (04): : 193 - 200
  • [10] Electrodeposition of Cu from acidic sulphate solutions containing cetyltrimethylammonium bromide (CTAB)
    Bozzini, Benedetto
    D'Urzo, Lucia
    Re, Marilena
    De Riccardis, Federica
    [J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 2008, 38 (11) : 1561 - 1569