Smooth Contact Capacitive Pressure Sensors in Touch- and Peeling-Mode Operation

被引:43
作者
Han, Jeahyeong [1 ]
Shannon, Mark A. [1 ]
机构
[1] Univ Illinois, Dept Engn Sci & Mech, Urbana, IL 61801 USA
关键词
Capacitive; peeling and touch-mode; pressure sensor; sensitivity; smooth Contact; FABRICATION;
D O I
10.1109/JSEN.2008.2011090
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Capacitive (C) pressure sensors typically sense quadratic changes in C as a pressure difference (P) deflects a flexible conducting diaphragm near a rigid ground plane. Touch-mode capacitive pressure (C-P) sensors, where the conducting diaphragm touches a dielectric coated ground plane, often show a more linear response, but with less sensitivity, particularly at low-P. Initial contact of the diaphragm often occurs at a critical P. Until P,,it is reached, the sensitivity is typically too low for accurate measurements. In this work, two different types of electrodes with "parabolic" and "donut" cavity-shapes have been designed, fabricated, and tested to achieve high-sensitivity at low-pressures. A flexible conducting diaphragm touches the bottom electrode smoothly, and both cavity shapes permit initial contact at a zero-pressure differential. This type of C-P sensors can have touch-mode and peeling-mode operations. The sensitivities of these sensors in two operation modes were measured, and their resolutions were smaller than 0.1 Pa at a mean pressure of 10(5) Pa. Both sensors in two modes have the resolution over total-pressure less than 10(-6), which is difficult to achieve at atmospheric pressure.
引用
收藏
页码:199 / 206
页数:8
相关论文
共 25 条
[1]   A surface micromachined capacitive pressure sensor for biomedical applications [J].
Babbitt, KE ;
Fuller, L ;
Keller, B .
PROCEEDINGS OF THE TWELFTH BIENNIAL UNIVERSITY/GOVERNMENT/INDUSTRY MICROELECTRONICS SYMPOSIUM, 1997, :150-153
[2]   Robust capacitive pressure sensor array [J].
Chang, SP ;
Lee, JB ;
Allen, MG .
SENSORS AND ACTUATORS A-PHYSICAL, 2002, 101 (1-2) :231-238
[3]   Demonstration for integrating capacitive pressure sensors with read-out circuitry on stainless steel substrate [J].
Chang, SP ;
Allen, MG .
SENSORS AND ACTUATORS A-PHYSICAL, 2004, 116 (02) :195-204
[4]   Electrostatic actuation as a self-testing method for silicon pressure sensors [J].
Cozma, A ;
Puers, R .
SENSORS AND ACTUATORS A-PHYSICAL, 1997, 60 (1-3) :32-36
[5]   Micromachined pressure sensors: Review and recent developments [J].
Eaton, WP ;
Smith, JH .
SMART MATERIALS AND STRUCTURES, 1997, 6 (05) :530-539
[6]   Design and fabrication of a multilayered polymer microfluidic chip with nanofluidic interconnects via adhesive contact printing [J].
Flachsbart, BR ;
Wong, K ;
Iannacone, JM ;
Abante, EN ;
Vlach, RL ;
Rauchfuss, PA ;
Bohn, PW ;
Sweedler, JV ;
Shannon, MA .
LAB ON A CHIP, 2006, 6 (05) :667-674
[7]   A PMMA-BASED micro pressure sensor chip using carbon nanotubes as sensing elements [J].
Fung, CKM ;
Zhang, MQH ;
Chan, RHM ;
Li, WJ .
MEMS 2005 MIAMI: TECHNICAL DIGEST, 2005, :251-254
[8]   A capacitive pressure sensor for MEMS [J].
Gupta, A ;
Ahmad, A ;
Singh, R .
SMART MATERIALS, STRUCTURES, AND SYSTEM, PTS 1 AND 2, 2003, 5062 :450-454
[9]  
HAN J, 2006, P ASME INT C CHIC IL, P711
[10]   Smooth contact mode capacitive pressure sensor with polyimide Diaphragm [J].
Han, Jeahyeong ;
Yeom, Junghoon ;
Lee, Junghyun ;
Shannon, Mark A. ;
Masel, Richard I. .
2007 IEEE SENSORS, VOLS 1-3, 2007, :1468-1471