Microstructure evolution of amorphous silicon thin films upon annealing studied by positron annihilation

Amorphous silicon (a-Si) thin films were prepared on glass substrates by plasma enhanced chemical vapor deposition (PECVD). Influence of annealing temperature on the microstructure, surface morphology, and defects evolution of the films were studied by X-ray diffraction (XRD), atomic force microscope (AFM) and positron annihilation Doppler broadening spectroscopy (DBS) based on a slow positron beam, respectively. The S parameter of the as-deposited a-Si thin film is high, indicative of amorphous state of Si film with many defects. The a-Si gradually grows into polycrystalline silicon with increasing temperature to 650 degrees C. For the films annealed below similar to 450 degrees C, positron diffusion lengths are rather small because most positrons are trapped in the defects of the a-Si films and annihilated there. With further rising the temperature to 600 degrees C, the diffusion length of positrons increases significantly due to the removal of vacancy-type defects upon annealing at a high temperature. The results indicate that the coalescence of small vacancy-type defects in a-Si thin film and the crystallization of a-Si occur around 450 degrees C and 650 degrees C, respectively.