Impact of Radiation on the Operation and Reliability of Deep Submicron CMOS Technologies

被引:2
|
作者
Claeys, C. [1 ,2 ]
Put, S. [1 ,2 ,3 ]
Griffoni, A. [1 ]
Cester, A. [4 ]
Gerardin, S. [4 ,5 ]
Meneghesso, G. [4 ]
Paccagnella, A. [4 ,5 ]
Simoen, E. [1 ]
机构
[1] IMEC, Kapeldreef 75, B-3001 Louvain, Belgium
[2] Katholieke Univ Leuven, Dept EE, B-3001 Leuven, Belgium
[3] CEN SCK, Belgian Nucl Res Ctr, B-2400 Mol, Belgium
[4] Univ Padua, Dipartimento Ingn Informazione, I-35131 Padua, Italy
[5] Ist Nazl Fis Nucl, I-35131 Padua, Italy
关键词
THIN GATE OXIDES; HEAVY-ION STRIKES; ELECTRICAL CHARACTERIZATION; SOI MOSFETS; WEAR-OUT; BREAKDOWN; DEGRADATION; IRRADIATION; INTERFACE; GROWTH;
D O I
10.1149/1.3360593
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
CMOS scaling has a beneficial impact on the radiation hardness of the technologies and often only requires a further optimization of either the Shallow Trench Isolation (STI) or the Buried Oxide (BOX) in case of a SOI technology. From a reliability viewpoint, heavy-ion induced ionization damage in the gate dielectric may lead to Radiation-Induced Leakage Current (RILC), Radiation-induced Soft Breakdown (RSB), Single Event Gate Rupture (SEGR) or the creation of latent damage. This paper discusses the present knowledge of the radiation impact on the operation and the reliability of deep submicron CMOS technologies.
引用
收藏
页码:39 / 46
页数:8
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