Direct photochemical formation of Cu patterns on surface modified polyimide resin

被引：32

作者：

Ikeda, S

Akamatsu, K

Nawafune, H

机构：

[1] Konan Univ, High Technol Res Ctr, Fac Sci & Engn, Higashinada Ku, Kobe, Hyogo 6588501, Japan

[2] Konan Univ, Grad Sch Sci, Higashinada Ku, Kobe, Hyogo 6588501, Japan

来源：

JOURNAL OF MATERIALS CHEMISTRY | 2001年 / 11卷 / 12期

关键词：

D O I：

10.1039/b107386a

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

A novel method is presented for the direct metallization of Cu on to surface modified polyimide resin by photochemical reduction of copper( II) ions with the aid of preadsorbed colloidal TiO2 as photocatalyst: for the first time copper circuit patterns are successfully fabricated simply by using a quartz-on-glass photomask without the requirement for a photoresist.

引用

收藏

页码：2919 / 2921

页数：3

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