Fully embedded ultra-wideband multilayer balun into organic packaging substrate

被引：3

作者：

Aliqab, Khaled ^{[1
]}

Hong, Jiasheng ^{[1
]}

机构：

[1] Heriot Watt Univ, Dept Elect Elect & Comp Engn, Sch Engn & Phys Sci, Edinburgh EH14 4AS, Midlothian, Scotland

来源：

IET MICROWAVES ANTENNAS & PROPAGATION | 2019年 / 13卷 / 03期

关键词：

baluns; liquid crystal polymers; electromagnetic shielding; ultra wideband technology; ultra-wideband multilayer balun; organic packaging substrate; liquid crystal polymer; broadside coupled stripline structure; balun design; miniaturised ultra-wideband multilayer balun; frequency; 6; 2; GHz; MICROSTRIP;

D O I：

10.1049/iet-map.2018.5859

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study presents a novel miniaturised ultra-wideband (UWB) multilayer balun embedded into organic packaging substrate of liquid crystal polymer. The broadside coupled stripline structure is adopted in this work to realise UWB performance and TEM mode. The fabricated prototype is self-packaged for electromagnetic shielding, and lightweight, with a small footprint. The proposed balun design achieves excellent amplitude and phase balances within the entire bandwidth, centred at 6.2 GHz. Simulation and measurement results show very good agreement.

引用

页码：322 / 325

页数：4

共 12 条

[1] Planar ultra-wideband balun using coupled microstrip lines [J].