Performance of Inversion, Accumulation, and Junctionless Mode n-Type and p-Type Bulk Silicon FinFETs With 3-nm Gate Length

被引:57
作者
Thirunavukkarasu, Vasanthan [1 ,2 ,3 ]
Jhan, Yi-Ruei [1 ]
Liu, Yan-Bo [1 ]
Wu, Yung-Chun [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Engn & Syst Sci, Hsinchu 300, Taiwan
[2] Acad Sinica, Nano Sci & Technol Program, Taiwan Int Grad Program, Hsinchu 300, Taiwan
[3] Natl Tsing Hua Univ, Hsinchu 300, Taiwan
关键词
FinFET; inversion; accumulation; junctionless; 3D TCAD simulation; 3-nm gate length;
D O I
10.1109/LED.2015.2433303
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We investigated the device performance of the optimized 3-nm gate length (L-G) bulk silicon FinFET device using 3-D quantum transport device simulation. By keeping source and drain doping constant and by varying only the channel doping, the simulated device is made to operate in three different modes such as inversion (IM) mode, accumulation (AC) mode and junctionless (JL) mode. The excellent electrical characteristics of the 3-nm gate length Si-based bulk FinFET device were investigated. The subthreshold slope values (SS similar to 65 mV/decade) and drain-induced barrier lowering (DIBL < 17 mV/V) are analyzed in all three IM, AC, and JL modes bulk FinFET with |V-TH| similar to 0.31 V. Furthermore, the threshold voltage (VTH) of the bulk FinFET can be easily tuned by varying the work function. This letter reveals that Moore's law can continue up to 3-nm nodes.
引用
收藏
页码:645 / 647
页数:3
相关论文
共 10 条
  • [1] [Anonymous], 2013, TABLE ORTC1 SUMMARY
  • [2] [Anonymous], 2014, TCAD SENT DEV SYN DE
  • [3] Colinge JP, 2010, NAT NANOTECHNOL, V5, P225, DOI [10.1038/NNANO.2010.15, 10.1038/nnano.2010.15]
  • [4] Performance Comparison Between Bulk and SOI Junctionless Transistors
    Han, Ming-Hung
    Chang, Chun-Yen
    Chen, Hung-Bin
    Wu, Jia-Jiun
    Cheng, Ya-Chi
    Wu, Yung-Chun
    [J]. IEEE ELECTRON DEVICE LETTERS, 2013, 34 (02) : 169 - 171
  • [5] Hu CM, 2004, 2004 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, P4
  • [6] Process-Variation Effect, Metal-Gate Work-Function Fluctuation, and Random-Dopant Fluctuation in Emerging CMOS Technologies
    Li, Yiming
    Hwang, Chih-Hong
    Li, Tien-Yeh
    Han, Ming-Hung
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2010, 57 (02) : 437 - 447
  • [7] Natarajan S., 2014, 2014 IEEE INT ELECT, P3, DOI [DOI 10.1109/IEDM.2014.7046976, 10.1109/IEDM.2014.7046976]
  • [8] Comparison of Junctionless and Conventional Trigate Transistors With Lg Down to 26 nm
    Rios, R.
    Cappellani, A.
    Armstrong, M.
    Budrevich, A.
    Gomez, H.
    Pai, R.
    Rahhal-orabi, N.
    Kuhn, K.
    [J]. IEEE ELECTRON DEVICE LETTERS, 2011, 32 (09) : 1170 - 1172
  • [9] Si, SiGe Nanowire Devices by Top-Down Technology and Their Applications
    Singh, Navab
    Buddharaju, Kavitha D.
    Manhas, S. K.
    Agarwal, A.
    Rustagi, Subhash C.
    Lo, G. Q.
    Balasubramanian, N.
    Kwong, Dim-Lee
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (11) : 3107 - 3118
  • [10] Yang-Kyu Choi, 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318), P919, DOI 10.1109/IEDM.1999.824298