Heat analysis of thermal overload relays using 3-D finite element method

被引:8
作者
Kawase, Y
Ichihashi, T
Ito, S
机构
[1] Gifu Univ, Dept Informat Sci, Gifu 5011193, Japan
[2] Fukuoka Inst Technol, Dept Elect, Higashi Ku, Fukuoka 8110295, Japan
关键词
heat analysis; overload relays; finite element method;
D O I
10.1109/20.767327
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In designing a thermal overload relay, it is necessary to analyze thermal characteristics of several trial models. Up to now, this has been done by measuring the temperatures on a number of positions in the trial models. This experimental method is undoubtedly expensive. In this paper, the temperature distribution of a thermal overload relay is obtained by using 3-D finite element analysis faking into account the current distribution in current-carrying conductors, It is shown that our 3-D analysis is capable of evaluating a new design of thermal overload relays.
引用
收藏
页码:1658 / 1661
页数:4
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