heat analysis;
overload relays;
finite element method;
D O I:
10.1109/20.767327
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
In designing a thermal overload relay, it is necessary to analyze thermal characteristics of several trial models. Up to now, this has been done by measuring the temperatures on a number of positions in the trial models. This experimental method is undoubtedly expensive. In this paper, the temperature distribution of a thermal overload relay is obtained by using 3-D finite element analysis faking into account the current distribution in current-carrying conductors, It is shown that our 3-D analysis is capable of evaluating a new design of thermal overload relays.