Short cycle killer-particle control based on accurate in-line defect classification

被引：2
|
作者：
Shimoda, A [1 ]
Watanabe, K [1 ]
Takagi, Y [1 ]
Maeda, S [1 ]
机构：
[1] Hitachi Ltd, Prod Engn Res Lab, Image Recognit & Inspect Syst Dept, Totsuka Ku, Kanagawa 2440817, Japan
来源：
ISSM 2000: NINTH INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING, PROCEEDINGS | 2000年
关键词：
particle; yield impact; ADC;
D O I：
10.1109/ISSM.2000.993648
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
We present a systematic yield ramp-up method that can quickly screen "killer" particles associated with yield loss and pinpoint their entry point to the process. The proposed method uses automatic defect classification (ADC) to segregate killer particles. The practicality of this method is demonstrated by the results of experiments using actual production wafers. This method will make killer particle control more timely.
引用
收藏
页码：199 / 202
页数：4
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