Thermal Performance Analysis and Optimization of Microjet Cooling of High-Power Light-Emitting Diodes

被引:16
作者
Husain, Afzal [1 ]
Kim, Sun-Min [1 ]
Kim, Jun-Hee [1 ]
Kim, Kwang-Yong [1 ]
机构
[1] Inha Univ, Dept Mech Engn, Inchon 402751, South Korea
基金
新加坡国家研究基金会;
关键词
ENHANCED MULTIOBJECTIVE OPTIMIZATION; SMALL HEAT-SOURCES; CORRELATING EQUATIONS; IMPINGEMENT; SYSTEM; MANAGEMENT; ARRAYS;
D O I
10.2514/1.T3931
中图分类号
O414.1 [热力学];
学科分类号
摘要
The present study investigates the thermal and hydraulic performance of the microjet array cooling system for thermal management of a high-power light-emitting diode array. Three-dimensional numerical analyses were performed for steady incompressible turbulent flow and conjugate heat transfer through a finite volume solver. The performances of several microjet array configurations, viz., 1-jet, 4-jet, 9-jet, 13-jet, and 16-jet arrays, were analyzed at two flow rates and top-cavity heights. The design optimization of a 4-jet array cooling system was performed using a multi-objective evolutionary algorithm. For the optimization, two design variables, viz., ratio of the nozzle diameter and height of the top cavity and ratio of the height and length of the top cavity, were selected. The thermal resistance and pressure drop were selected as the objective functions of the design. The Pareto-optimal solutions were obtained and discussed in view of the thermal resistance and pressure drop and sensitivity of design variables to objective functions.
引用
收藏
页码:235 / 245
页数:11
相关论文
共 35 条
[1]   Numerical simulation of three-dimensional laminar multiple impinging square jets [J].
Aldabbagh, LBY ;
Sezai, I .
INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW, 2002, 23 (04) :509-518
[2]   Thermal analysis of power LED employing dual interface method and water flow as a cooling system [J].
Anithambigai, P. ;
Dinash, K. ;
Mutharasu, D. ;
Shanmugan, S. ;
Lim, Choon Kim .
THERMOCHIMICA ACTA, 2011, 523 (1-2) :237-244
[3]  
[Anonymous], THESIS
[4]  
[Anonymous], 2006, CFX 11 0 SOLVER THEO
[5]  
[Anonymous], 2011, INT J FLUID MACHINER
[6]   Thermal management of LEDs: Package to system [J].
Arik, M ;
Becker, C ;
Weaver, S ;
Petroski, J .
THIRD INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2004, 5187 :64-75
[7]   Thermal effects in packaging high power light emitting diode arrays [J].
Christensen, Adam ;
Graham, Samuel .
APPLIED THERMAL ENGINEERING, 2009, 29 (2-3) :364-371
[8]  
Deb K., 2010, MULTIOBJECTIVE OPTIM
[9]   Optimized heat transfer for high power electronic cooling using arrays of microjets [J].
Fabbri, M ;
Dhir, VK .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2005, 127 (07) :760-769
[10]   Confined and submerged liquid jet impingement heat transfer [J].
Garimella, SV ;
Rice, RA .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1995, 117 (04) :871-877