Local and Global Properties of a Lead-Free Solder

被引：5
作者：
Ma, Z. [1 ]
Chalon, F. [1 ]
Leroy, R. [1 ]
Ranganathan, N. [1 ]
Beake, B. D. [2 ]
机构：
[1] Univ Tours, LMR, Polytech Tours, F-37200 Tours, France
[2] Micro Mat Ltd, Wrexham LL13 7YL, Wales
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2014年 / 43卷 / 03期
关键词：
Lead-free solder; elastic modulus; creep; nanoindentation; nanoimpact; intermetallics; CREEP-BEHAVIOR; NANOMECHANICAL CHARACTERIZATION; NANOINDENTATION CREEP; MECHANICAL-PROPERTIES; DEFORMATION-BEHAVIOR; ALUMINUM-ALLOY; SN; INDENTATION; NI; SUPERPLASTICITY;
D O I：
10.1007/s11664-013-2666-0
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Elastic and viscous properties including Young's modulus, hardness, creep rate sensitivity, and fatigue resistance of Sn-1.2Ag-0.5Cu-0.05Ni lead-free solder have been investigated. The properties of bulk specimens and in situ solder balls are compared. Experiments show good correlations of Young's modulus and creep rate sensitivity between conventional measurements and nanoindentation results on bulk specimens. Further mechanical properties of the beach-ball microstructure in solder balls are characterized by nanoindentation. The load-partial unload technique has been used to determine the variation in mechanical properties with increasing depth of penetration into the intermetallic inclusions in the in situ solder. The fatigue resistances of the bulk specimens and solder balls are compared by using the novel nanoimpact method. In comparison with bulk specimens, it is found that in situ solder has higher Young's modulus, lower creep strain rate sensitivity, and better fatigue resistance. The effects of soldering and the scale differences strongly affect the mechanical and fatigue properties of in situ solder.
引用
收藏
页码：658 / 670
页数：13
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