Modal analysis of IGBT power devices based on ANSYS

被引：1

作者：

Wang, Haojie ^{[1
]}

Liu, Dongjing ^{[2
,3
]}

Fan, Yasong ^{[1
]}

Wu, Yanchen ^{[1
]}

Qiao, Tieliang ^{[1
]}

Yang, D. G. ^{[1
]}

机构：

[1] Guilin Univ Elect Technol, Sch Mech & Engn, Guilin, Peoples R China

[2] Guilin Univ Elect Technol, Guilin, Peoples R China

[3] Jiangsu Univ, Zhenjiang, Jiangsu, Peoples R China

来源：

ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY | 2019年

基金：

中国博士后科学基金;

关键词：

vibration; IGBT module; finite element simulation; reliability;

D O I：

10.1109/ICEPT47577.2019.245111

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper addresses the stability and reliability of IGBT operation under vibration conditions. Firstly, the structure of the module is built by soildworks; secondly, the ANSYS finite element analysis software is used as a platform to perform random vibration analysis on the structure; finally, a reasonable fatigue life calculation model is constructed based on the Conffin-Manson equation and the cumulative damage rule of Minter's, the fatigue life of the welded layer under random vibration load is calculated. Find out the difference in fatigue life of the weld layer between different structures and optimize the model. The result provides certain reference value and guiding significance for guiding the optimal design and reliability design of IGBT power module.

引用

页数：4

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