Analysis of transient thermoelastic temperature distribution of a thin circular plate and its thermal deflection under uniform heat generation

被引:3
|
作者
Gaikwad, Kishor R. [1 ]
Naner, Yogesh U. [2 ]
机构
[1] Nanded Educ Soc, Post Grad Dept Math, Sci Coll, Nanded 431601, Maharashtra, India
[2] Shri Vitthal Rukhmini Arts Commerce & Sci Coll, Dept Math, Yavatmal, Maharashtra, India
关键词
Thermal deflection; thermoelastic problem; thin circular plate; uniform heat generation; STRESS-ANALYSIS; DEFORMATION; CONDUCTION;
D O I
10.1080/01495739.2020.1828009
中图分类号
O414.1 [热力学];
学科分类号
摘要
Analysis of transient thermoelastic temperature distribution of a thin circular plate and its thermal deflection under uniform internal heat generation is investigated. The upper and lower surfaces are thermally insulated, while the perimetric surface is subjected to convection heat transfer with convection coefficient h(c) and fluid temperature T-infinity,while the plate is also subjected to uniform internal energy generation g(0) (W.m(-3)). The integral transform method is used to obtain the analytical solution for the temperature field and thermal deflection. As a special case, the mathematical model is prepared for copper material, and temperature distribution is analyzed for two different initial conditions. The results for temperature changes and the thermal deflection are computed numerically and illustrated graphically.
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页码:75 / 85
页数:11
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