Grinding Force of Ultrasonic Vibration Assisted Grinding Combined with EDM

被引：1

作者：

Yan Peng ^{[1
]}

Zhang Jianhua ^{[2
]}

Su Guosheng ^{[1
]}

机构：

[1] Shandong Polytech Univ, Jinan, Peoples R China

[2] Shandong Univ, Jinan, Peoples R China

来源：

ADVANCES IN MATERIALS PROCESSING X | 2012年 / 500卷

关键词：

ultrasonic vibration; pulse discharge; grinding force model;

D O I：

10.4028/www.scientific.net/AMR.500.287

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

In the ultrasonic vibration assisted grinding and EDM, grinding and pulse discharge machining are favorable conditions for each other, can significantly improve the processing efficiency by adjusting the processing parameters, and get high-quality machined surface. The grinding force is an important parameter in characterizing the grinding process, which is the g the main object of study in grinding process. The interaction of ultrasonic vibration, grinding and EDM is investigated. From the view of material removal volume, the volume of removal by EMD is calculated. Then the volume by grinding is gotten. The grinding force model of combined machining is established. The influence machining parameters on grinding force is studied, which is helpful for the detection and control of grinding force.

引用

页码：287 / +

页数：2

共 12 条

[1] Groove, chip and force formation in single grain high-speed grinding [J].

Feng, BF ;

Cai, GQ ;

Sun, XL .

ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XIII, 2006, 304-305 :196-200

[2]

Fengguo Cao, 2004, ELECT DISCHARGE MACH

[3]

Kun Li, 1997, J MAT PROCESSI UNPUB

[4]

Li L., 1980, ANN CIRP, V29, P245

[5]

Lijun Li, 1981, J MECH ENG UNPUB

[6]

Shanliang Zheng, 1988, GRINDING BASED

[7]

Werner G., 1978, ANN CIRP, V27, P20

[8]

Yong He, 2002, J DIAMOND ABRA UNPUB

[9]

Zhang HX, 2007, THESIS

[10]

Zhang J., 2008, Microstructure Study of Cementitious Materials Using Resistivity Measurement

← 1 2 →