Review on micro molding of thermoplastic polymers

被引：690
作者：
Heckele, M [1 ]
Schomburg, WK [1 ]
机构：
[1] Forschungszentrum Karlsruhe, Inst Mikrostrukt Tech, D-76021 Karlsruhe, Germany
来源：
JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2004年 / 14卷 / 03期
关键词：
D O I：
10.1088/0960-1317/14/3/R01
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Molding of micro components from thermoplastic polymers has become a routinely used industrial production process. This paper describes both the more than 30-year-old history and the present state of development and applications. Hot embossing, injection molding, reaction injection molding, injection compression molding, thermoforming, and various types of tool fabrication are introduced and their advantages and drawbacks are discussed. In addition, design considerations, process limitations, and commercially available micro molding machines are presented.
引用
收藏
页码：R1 / R14
页数：14
相关论文
共 88 条
  • [1] BADER R, 2000, Patent No. 1030896
  • [2] BARALDI L, 1993, P SOC PHOTO-OPT INS, V1992, P21, DOI 10.1117/12.165703
  • [3] EMBOSSED HOLOGRAM MOTION PICTURES FOR TELEVISION PLAYBACK
    BARTOLINI, R
    HANNAN, W
    KARLSONS, D
    LURIE, M
    [J]. APPLIED OPTICS, 1970, 9 (10) : 2283 - +
  • [4] Becker E. W., 1986, Microelectronic Engineering, V4, P35, DOI 10.1016/0167-9317(86)90004-3
  • [5] BECKER EW, 1982, NATURWISSENSCHAFTEN, V69, P520, DOI 10.1007/BF00463495
  • [6] Microfluidic devices for μ-TAS applications fabricated by polymer hot embossing
    Becker, H
    Dietz, W
    [J]. MICROFLUIDIC DEVICES AND SYSTEMS, 1998, 3515 : 177 - 182
  • [7] BENISCH J, 2001, Patent No. 10004853
  • [8] BIER W, 1988, Patent No. 5005163
  • [9] BIER W, 1988, Patent No. 3842610
  • [10] Blankenstein G., 2000, MST News, P14
123456789