Stabilizing Resistive Switching Characteristics by Inserting Indium-Tin-Oxide Layer as Oxygen Ion Reservoir in HfO2-Based Resistive Random Access Memory

被引:38
作者
Chen, Po-Hsun [1 ]
Su, Yu-Ting [2 ]
Chang, Fu-Chen [3 ]
机构
[1] Chinese Naval Acad, Dept Appl Sci, Kaohsiung 813, Taiwan
[2] Natl Sun Yat Sen Univ, Dept Phys, Kaohsiung 804, Taiwan
[3] Natl Chiao Tung Univ, Dept Electrophys, Hsinchu 300, Taiwan
关键词
HfO2; insulator; indium-tin-oxide (ITO); oxygen ion reservoir; resistive random access memory (RRAM); PLASMA TREATMENT;
D O I
10.1109/TED.2019.2895079
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper investigates the issues of oxygen accumulation and variation in the high-resistance state of HfO2-based resistive random access memory (RRAM), with improvement attained by inserting a thin oxygen-vacancy-rich layer of indium-tin-oxide (ITO) film. By acting as the oxygen ion reservoir, this ITO thin film on the TiN electrode can further stabilize resistance switching (RS) characteristics. In terms of reliability, ac endurance, and retention tests confirm stable RS characteristics for the Pt/HfO2/ITO/TiN device. Finally, a conducting model was proposed to explain the influence of the ITO thin layer and clarify the physical mechanism of electrical improvements.
引用
收藏
页码:1276 / 1280
页数:5
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