Simulation of thermal and electric field evolution during spark plasma sintering

被引:112
作者
Tiwari, Devesh [2 ]
Basu, Bikramjit [1 ]
Biswas, Koushik [3 ]
机构
[1] Indian Inst Technol, Dept Mat & Met Engn, Kanpur 208016, Uttar Pradesh, India
[2] Indian Inst Technol, Dept Comp Sci & Engn, Kanpur 208016, Uttar Pradesh, India
[3] Indian Inst Technol, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, India
关键词
Sintering; Powders; Electrical conductivity; SINTERING/SYNTHESIS PROCESS; FUNDAMENTAL INVESTIGATIONS; DENSIFICATION; GROWTH; MICROSTRUCTURE; NANOCOMPOSITES; CONSOLIDATION;
D O I
10.1016/j.ceramint.2008.02.013
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Finite element simulations have been conducted to determine the temperature distribution (both in radial and axial direction), heat and electric flux-field in the powder compact/die/punch assembly during the spark plasma sintering (SPS) process. A thermal-electrical coupled model with temperature dependent thermal and electrical properties is implemented. The simulation studies were conducted using both ABAQUS and MATLAB and a range of power input, varying thermal conductivity of powder compact were considered. Also, the effect of time variation on both thermal and electric field evolution was assessed. During SPS, the heat transmission pattern and the temperature difference between the specimen center and the die surface depend on thermal conductivity of the powder compact, time of sintering and power input. The simulation results also revealed that the temperature gradient across the powder compact/graphite die wall is higher for conditions of higher power input and/or powder compact with lower thermal conductivity. (C) 2008 Elsevier Ltd and Techna. Group S.r.l. All rights reserved.
引用
收藏
页码:699 / 708
页数:10
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