Numerical investigation of fracture behavior of nanostructured Cu with bimodal grain size distribution

被引:18
作者
Guo, X. [1 ,2 ]
Dai, X. Y. [1 ]
Zhu, L. L. [3 ]
Lu, J. [4 ]
机构
[1] Tianjin Univ, Sch Mech Engn, Tianjin 300072, Peoples R China
[2] Tianjin Key Lab Nonlinear Dynam & Chaos Control, Tianjin 300072, Peoples R China
[3] Zhejiang Univ, Sch Aeronaut & Astronaut, Dept Engn Mech, Hangzhou 310027, Zhejiang, Peoples R China
[4] City Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong, Hong Kong, Peoples R China
关键词
NANOGRAINED INTERFACE LAYERS; STRAIN GRADIENT PLASTICITY; FINITE-ELEMENT-METHOD; NANOCRYSTALLINE MATERIALS; STAINLESS-STEEL; HIGH-STRENGTH; DEFORMATION; METALS; DUCTILITY; MICROSTRUCTURE;
D O I
10.1007/s00707-013-1050-8
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
Nanostructured metals with bimodal grain size distribution, composed of coarse grain (CG) and nanograin (NG) regions, have proved to have high strength and good ductility. Here, numerical investigation, based on the mechanism-based strain gradient plasticity theory and the Johnson-Cook failure model, focuses on effects of (1) distribution characteristics of the CG regions and (2) the constitutive relation of the NG with different grain sizes on fracture behavior in a center-cracked tension specimen of bimodal nanostructured Cu. High strain rate simulations show that both of them directly influence load response and energy history, and importantly, they are closely related to the fracture pattern. This study shows that both CG region bridging and crack deflection toughen the bimodal nanostructured Cu significantly, while debonding enhances the overall ductility moderately. Simulations also show that with volume fraction of the CG regions increasing, both structural strength and ductility of the bimodal nanostructured Cu specimen can be improved.
引用
收藏
页码:1093 / 1106
页数:14
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