Annealing behavior of cryogenically-rolled copper

被引:23
作者
Konkova, T. [1 ]
Mironov, S. [2 ]
Korznikov, A. [1 ]
Myshlyaev, M. M. [3 ]
Semiatin, S. L. [4 ]
机构
[1] Russian Acad Sci, Inst Met Superplast Problems, Ufa 450001, Russia
[2] Tohoku Univ, Grad Sch Engn, Dept Mat Proc, Sendai, Miyagi 9808579, Japan
[3] Russian Acad Sci, Baikov Inst Met & Mat Sci, Moscow 119991, Russia
[4] AFRL RXCM, Air Force Res Lab, Mat & Mfg Directorate, Wright Patterson AFB, OH 45433 USA
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2013年 / 585卷
关键词
EBSD; Nanostructured materials; Thermomechanical processing; Recrystallization; Grain growth; MG-SI ALLOY; MECHANICAL-PROPERTIES; PLASTIC-DEFORMATION; PURE COPPER; MICROSTRUCTURE; TEMPERATURE; EVOLUTION;
D O I
10.1016/j.msea.2013.07.042
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The static annealing behavior of cryogenically-rolled copper over a wide temperature range (50-950 degrees C) was established. At temperatures below 350 degrees C (similar to 0.5T(m)), microstructure and texture evolution were interpreted in terms of discontinuous recrystallization. Grains having orientations close to (55;30/60;0), {236}< 385 > (Brass-R), and {4;4;11}< 11;11;8 > (Dillamore) were shown to recover rapidly and thus exhibited preferential growth during subsequent static recrystallization. At temperatures of 350 degrees C and higher, annealing behavior was dominated by abnormal grain growth. The abnormal character of this process was attributed to the relatively large spread in grain sizes produced during preceding recrystallization. (C) 2013 Elsevier B.V. All rights reserved.
引用
收藏
页码:178 / 189
页数:12
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