Identification of phases in Sn-Ag-Cu-In solder on Cu substrate interface

被引：0

作者：

Sebo, P. ^{[1
]}

Svec, P. ^{[2
]}

Janickovic, D. ^{[2
]}

Moser, Z. ^{[3
]}

机构：

[1] Slovak Acad Sci, Inst Mat & Machine Mech, Bratislava 83102, Slovakia

[2] Slovak Acad Sci, Inst Phys, Bratislava 84236, Slovakia

[3] Polish Acad Sci, Inst Met & Mat Sci, PL-30059 Krakow, Poland

来源：

KOVOVE MATERIALY-METALLIC MATERIALS | 2008年 / 46卷 / 04期

关键词：

X-scan; lead-free solder; copper; interface; phase analysis;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Determination of the phases arising at the interface between lead-free Sn3.5Ag0.4Cu29.5In solder and copper substrate after wetting of copper at 280 degrees C for 1800 s is presented. Compared are results obtained with methods of scanning electron microscopy (SEM) equipped with EDX analyser, X-ray diffraction and X-scan X-ray diffraction method. Standard X-ray diffraction profile shows the existence of four phases In0.2Sn0.8, Cu6Sn5, In3Sn and Ag3Sn. X-scan X-ray diffraction profile shows the presence of two phases at the interface In0.2Sn0.8 and Cu6Sn5 and adjacent phase to the copper substrate is In0.2Sn0.8 phase. Comparison of both methods is discussed.

引用

页码：235 / 238

页数：4

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