Nanostructured bulk thermoelectric materials and their properties

被引:2
|
作者
Lee, E [1 ]
Ryu, J [1 ]
Bhattacharya, S [1 ]
Tritt, T [1 ]
机构
[1] Aspen Syst Inc, Marlborough, MA 01752 USA
来源
ICT: 2005 24th International Conference on Thermoelectrics | 2005年
关键词
D O I
10.1109/ICT.2005.1519941
中图分类号
O414.1 [热力学];
学科分类号
摘要
Advanced bulk thermoelectric materials have been developed by fabricating composites of uniformly distributed thermoelectric nanoparticles within a high surface area semiconductor matrix. In this composite structure, constituents of the thermoelectric materials' figure of merit can be decoupled and controlled independently, and consequently, one can achieve a high thermoelectric figure of merit. The produced composites exhibited extremely low thermal conductivity and relatively high electrical conductivity. However, the Seebeck coefficient was relatively low, probably due to poor quality of the thermoelectric particles. In an in-plane test geometry (van der Pauw configuration), the electrical resistivity of the composite sample decreased continuously as temperature increased, a typical semiconductor behavior. In the perpendicular-to-the-plane (cross-plane) test geometry, electrical resistance of the sample increased continuously with increasing temperature, probably a semi-metallic behavior. This anisotropy in the electrical resistance was reproducible. We also observed relatively strong high frequency AC-signals in the in-plane test geometry samples.
引用
收藏
页码:272 / 275
页数:4
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