Stiction in surface micromachining

被引:433
作者
Tas, N
Sonnenberg, T
Jansen, H
Legtenberg, R
Elwenspoek, M
机构
[1] MESA Research Institute, University of Twente, 7500 AE Enschede
关键词
D O I
10.1088/0960-1317/6/4/005
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Due to the smoothness of the surfaces in surface micromachining, large adhesion forces between fabricated structures and the substrate are encountered. Four major adhesion mechanisms have been analysed: capillary forces, hydrogen bridging, electrostatic forces and van der Waals forces. Once contact is made adhesion forces can be stronger than the restoring elastic forces and even short, thick beams will continue to stick to the substrate. Contact, resulting from drying liquid after release etching, has been successfully reduced. In order to make a fail-safe device stiction during its operational life-time should be anticipated. Electrostatic forces and acceleration forces caused by shocks encountered by the device can be large enough to bring structures into contact with the substrate. In order to avoid in-use stiction adhesion forces should therefore be minimized. This is possible by coating the device with weakly adhesive materials, by using bumps and side-wall spacers and by increasing the surface roughness at the interface. Capillary condensation should also be taken into account as this can lead to large increases in the contact area of roughened surfaces.
引用
收藏
页码:385 / 397
页数:13
相关论文
共 59 条
[1]   EFFECTS OF ELEVATED-TEMPERATURE TREATMENTS IN MICROSTRUCTURE RELEASE PROCEDURES [J].
ABE, T ;
MESSNER, WC ;
REED, ML .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1995, 4 (02) :66-75
[2]  
ABE T, 1995, MICRO ELECTRO MECHANICAL SYSTEMS - IEEE PROCEEDINGS, 1995, P94, DOI 10.1109/MEMSYS.1995.472547
[3]  
ALLEY RL, 1993, P 7 INT C SOL STAT S, P288
[4]  
ALLEY RL, 1992, P IEEE SOL STAT SENS, P202
[5]  
ANDERSON KM, 1991, MICROMECH SENSORS AC, P255
[6]   Friction and pull-off force on silicon surface modified by FIB [J].
Ando, Y ;
Ino, J ;
Ozaki, K ;
Ishikawa, Y ;
Kitahara, T .
NINTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS, IEEE PROCEEDINGS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND SYSTEMS, 1996, :349-353
[7]  
[Anonymous], 1988, EL DEV M 1988 IEDM 8
[8]  
[Anonymous], 1990, TRIBOLOGY MECH MAGNE
[9]   Adhesion forces reduction for micro manipulation based on micro physics [J].
Arai, F ;
Andou, D ;
Fukuda, T .
NINTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS, IEEE PROCEEDINGS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND SYSTEMS, 1996, :354-359
[10]   BOND-STRENGTH MEASUREMENTS RELATED TO SILICON SURFACE HYDROPHILICITY [J].
BACKLUND, Y ;
HERMANSSON, K ;
SMITH, L .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1992, 139 (08) :2299-2301