Composite effects of reflections and ground bounce for signal line through a split power plane

被引：0

作者：

Lin, SM ^{[1
]}

Wu, RB ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Elect Engn, Taipei 10617, Taiwan

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2001年

关键词：

D O I：

10.1109/EPEP.2001.967618

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in signal return path and ground bounce between power/ground planes. A new equivalent circuit model is proposed and simulations are performed for a three-layer structure to characterize ground bounce coupling.

引用

页码：89 / 92

页数：4