Plastic behaviour of copper polycrystal subjected to fatigue-tension sequential loading tests

被引:0
作者
Jia, WP [1 ]
Fernandes, JV
机构
[1] Anshan Univ Sci & Technol, Dept Mat Sci & Engn, Anshan 114044, Peoples R China
[2] Univ Coimbra, Dept Engn Mecan, FCTUC, CEMUC, P-3030 Coimbra, Portugal
来源
ADVANCED MATERIALS FORUM III, PTS 1 AND 2 | 2006年 / 514-516卷
关键词
polycrystal; fatigue; sequential loading; strain path change;
D O I
10.4028/www.scientific.net/MSF.514-516.897
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Sequences of fatigue-tension tests were performed on copper polycrystal sheet, with 32 mu m mean grain size. The effect of strain path change on subsequent reloading yield stress as well as work hardening rate has been investigated. Dislocation microstructure was observed by transmission electron microscopy after mechanical tests. Under present conditions, it was found that fatigue prestraining caused the increase of reloading yield stress, larger amplitude of strain path change resulted in higher reloading yield stress and lower work hardening rate. Reloading tensile curves are independent of predeformation plastic strain amplitudes in both cases. Many isolated dislocation lines between cell walls have been detected for Phi=0 degrees case when the subsequent tension strain amount is 5%, this can be well understood from the microscopic dislocation slip mechanisms. When the reloading tension tests have been done until rupture, dislocation structures become typical of monotonic tension without preloading. The correlation of mechanical properties and microstructural observations was discussed in this paper.
引用
收藏
页码:897 / 900
页数:4
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