A Numerical Study of Thermal Spreading/Constriction Resistance of Silicon

被引：0
|
作者：
Rahmani, Yousef [1 ]
Shokouhmand, Hossein [2 ]
机构：
[1] Islamic Azad Univ, Takestan Branch, Takestan, Iran
[2] Univ Tehran Tehran, Mech Engn Dept, Tehran, Iran
来源：
2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM) | 2012年
关键词：
Thermal Spreading Resistance; Isotropic Half-Space; Heat Flux Tube; Temperature-Dependent Thermal Conductivity;
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Thermal spreading or constriction resistances exist whenever heat flows from one region to another in different cross sectional areas. In this study, the ideas of Isotropic half-space and Heat flux tube are numerically modeled in order to estimate the thermal spreading/constriction resistance. Furthermore, the thermal spreading resistances of the Silicon in arbitrary temperature and heat flux ranges are calculated for assessing the temperature-dependent thermal conductivity effects. Finally, different sizes of contact area in the Heat flux tube pattern are used to obtain the effect of contact size on the thermal spreading/constriction resistance. Results clearly indicate that the thermal spreading/constriction resistance is affected by the temperature-dependent conductivity of solids, shape of contact surface, size of contact and boundary conditions.
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页码：482 / 486
页数：5
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