A Numerical Study of Thermal Spreading/Constriction Resistance of Silicon

Thermal spreading or constriction resistances exist whenever heat flows from one region to another in different cross sectional areas. In this study, the ideas of Isotropic half-space and Heat flux tube are numerically modeled in order to estimate the thermal spreading/constriction resistance. Furthermore, the thermal spreading resistances of the Silicon in arbitrary temperature and heat flux ranges are calculated for assessing the temperature-dependent thermal conductivity effects. Finally, different sizes of contact area in the Heat flux tube pattern are used to obtain the effect of contact size on the thermal spreading/constriction resistance. Results clearly indicate that the thermal spreading/constriction resistance is affected by the temperature-dependent conductivity of solids, shape of contact surface, size of contact and boundary conditions.