Assembly and Electrical Characterization of Multiwall Carbon Nanotube Interconnects

被引：20
作者：
Close, Gael F. [1 ,2 ]
Wong, H. -S. Philip [1 ,2 ]
机构：
[1] Stanford Univ, Ctr Integrated Syst, Stanford, CA 94025 USA
[2] Stanford Univ, Dept Elect Engn, Stanford, CA 94025 USA
来源：
IEEE TRANSACTIONS ON NANOTECHNOLOGY | 2008年 / 7卷 / 05期
基金：
美国国家科学基金会;
关键词：
Carbon nanotube; interconnects; nanoelectronics; nanofabrication;
D O I：
10.1109/TNANO.2008.927373
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We demonstrate a general method to assemble and contact arrays of individual multiwall carbon nanotube (MWCNT) interconnects between electrodes in one batch. We have also collected about 200 resistance measurements to compare four different contact metals: Al, Au, Ti, and Pd. We have also measured the radio frequency characteristics of the assembled MWCNTs up to 15 GHz. High-resolution transmission electron microscopy analysis has been used to correlate the electrical and physical characteristics of the MWCNTs.
引用
收藏
页码：596 / 600
页数：5
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