Electron work function: A parameter sensitive to the adhesion behavior of crystallographic surfaces

被引：68

作者：

Li, DY ^{[1
]}

Li, W ^{[1
]}

机构：

[1] Univ Alberta, Dept Chem & Mat Engn, Edmonton, AB T6G 2G6, Canada

来源：

APPLIED PHYSICS LETTERS | 2001年 / 79卷 / 26期

关键词：

D O I：

10.1063/1.1428766

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The adhesive force (AF) and the electron work function (EWF) of different crystallographic planes of Cu were determined, with the aim of exploring the potential application of the Kelvin method in characterizing the adhesion of solid surfaces especially those in nano/microdevices. It was demonstrated that there was a close correlation between the EWF and AF, and both the parameters were dependent on the surface atomic arrangement. This study indicates that the EWF is a parameter that could be used to characterize the adhesion behavior of a surface. (C) 2001 American Institute of Physics.

引用

页码：4337 / 4338

页数：2

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