In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction

被引：16

作者：

Zhang, Q. K. ^{[1
]}

Zhang, Z. F. ^{[1
]}

机构：

[1] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China

来源：

SCRIPTA MATERIALIA | 2012年 / 67卷 / 03期

关键词：

Sn-4Ag solder; In situ tensile creep; Electron backscatter diffraction (EBSD); Polygonization; Grains subdivision; SN-AG; STRESS-RELAXATION; FRACTURE-BEHAVIOR; THERMAL FATIGUE; DEFORMATION; GRAIN; RECRYSTALLIZATION; MICROSTRUCTURE; ORIENTATION; EVOLUTION;

D O I：

10.1016/j.scriptamat.2012.05.005

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

In this study, the in situ tensile creep behaviors of Sn-4Ag/Cu solder joints were observed, and microstructural evolutions of the solder during the deformation processes were characterized by electron backscatter diffraction. The results reveal that slow plastic deformation or grain rotation occurs inside different solder grains, depending on their orientations and distance from the joint interface. When the strain increases to a certain extent, dynamic recovery occurs inside some solder grains, resulting in polygonization and grain subdivision. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：289 / 292

页数：4

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