This paper presented a series of anion-nonionic surfactants with different hydrophobic tails and hydrophilic head-groups. Changes in physic-chemical properties of these products and their influencing factors were carefully studied. The CMC (critical micelle concentration) ranges from 1.1 x 10(-2) mass% for NPS-4 to 4.8 x 10(-2) mass% in the case of NPS-10. The values (gamma(cmc)) of surface tension at CMC are from 31.62 mN m(-1) for NPS-4 to 44.50 mN m(-1) for AES-9. Maximum surface excess concentration (Gamma(max)) was more than 0.73 x 10(-6) mol m(-2) and minimum area per molecule at the water/air interface (A(min)) was less than 2.270 nm(2) molecule(-1). Results show that CMC and gamma(cmc) were efficiently improved, and the ability of reducing equilibrium interface tension (IFTeq) was weakened due to the increasing of repeat units. The study demonstrated that the detergents with the additional rigid group in the hydrophobic tail had a higher CMC than those with the alkyl chain. In addition, we figured out some IFTeq results of the surfactants solution under the influence of alkaline/salt. Ultra-low IFTeq can be obtained only when the concentration is greater than the optimal value of alkaline/salt. Dynamic interface tension (IFTdy) was analyzed and a hypothetical mechanism was used to explain the interesting phenomena IFTdy. (c) 2012 Elsevier B.V. All rights reserved.
机构:State Univ of New York at Buffalo,, Dep of Chemical Engineering,, Amherst, NY, USA, State Univ of New York at Buffalo, Dep of Chemical Engineering, Amherst, NY, USA
GOOD, RJ
OSTROVSKY, MV
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机构:State Univ of New York at Buffalo,, Dep of Chemical Engineering,, Amherst, NY, USA, State Univ of New York at Buffalo, Dep of Chemical Engineering, Amherst, NY, USA
机构:State Univ of New York at Buffalo,, Dep of Chemical Engineering,, Amherst, NY, USA, State Univ of New York at Buffalo, Dep of Chemical Engineering, Amherst, NY, USA
GOOD, RJ
OSTROVSKY, MV
论文数: 0引用数: 0
h-index: 0
机构:State Univ of New York at Buffalo,, Dep of Chemical Engineering,, Amherst, NY, USA, State Univ of New York at Buffalo, Dep of Chemical Engineering, Amherst, NY, USA