共 31 条
- [3] Ionization of sputtered metals in high power pulsed magnetron sputtering [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2005, 23 (01): : 18 - 22
- [9] DIRECTIONAL DEPOSITION OF CU INTO SEMICONDUCTOR TRENCH STRUCTURES USING IONIZED MAGNETRON SPUTTERING [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1995, 13 (02): : 203 - 208
- [10] Improving the quality of barrier/seed interface by optimizing physical vapor deposition of Cu Film in hollow cathode magnetron [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2011, 29 (04):