Fabrications of high-aspect ratio microstructure on metallic substrate using SU-8 resist

被引：0
|
作者：
Liu, JQ [1 ]
Cai, BC [1 ]
Zhu, J [1 ]
Ding, GP [1 ]
Zhao, XL [1 ]
Yang, CS [1 ]
Chen, D [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Thin Film & Microfabricat Key Lab State Educ Mini, Informat Storage Res Ctr, Shanghai 200030, Peoples R China
来源：
MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY AND DEVICES | 2001年 / 4601卷
关键词：
UV-LIGA; SU-8; high aspect ratio; metallic substrate; NMMS;
D O I：
10.1117/12.444698
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
SU-8 is a negative, epoxy type, near-UV photoresist. The resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications. The adhesion of the SU-8 resist with the metallic substrate is very poor, but it is necessary to overcome this shortcoming for providing low-cost LIGA-type process in MEMS applications. In this paper, several metallic films are used as the substrates. The Ti film with oxidation treatment is found to have the strongest adhesion to the resist. SU-8 resist has been proven to be very sensitive to process variations, so the experimental optimizing technique is used in the process. Using processing parameters as control factors, experiments are performed and results are evaluated. As the results being analyzed, a proposed fabrication process is derived from optimizing the control factors. The output structure has straight sidewall profile, fine line and space resolution. The aspect ratio is greater than 20.
引用
收藏
页码：200 / 204
页数：5
相关论文
共 50 条
  • [31] SU-8 plating mold for high-aspect-ratio nickel zone plates
    Lindblom, M.
    Hertz, H. M.
    Holmberg, A.
    MICROELECTRONIC ENGINEERING, 2007, 84 (5-8) : 1136 - 1139
  • [32] The effects of adhesion energy on the fabrication of high-aspect-ratio SU-8 microstructures
    Hwang, Kyu-Youn
    Park, Chin-Sung
    Kim, Joon-Ho
    Suh, Kahp-Yang
    Cho, Eun-Chul
    Huh, Nam
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2010, 20 (11)
  • [33] Fabrication of support structures to prevent SU-8 stiction in high aspect ratio structures
    Vora, K. D.
    Peele, A. G.
    Shew, B. -Y.
    Harvey, E. C.
    Hayes, J. P.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2007, 13 (5-6): : 487 - 493
  • [34] Fabrication of support structures to prevent SU-8 stiction in high aspect ratio structures
    K. D. Vora
    A. G. Peele
    B.-Y. Shew
    E. C. Harvey
    J. P. Hayes
    Microsystem Technologies, 2007, 13 : 487 - 493
  • [35] Fabrication of High Aspect Ratio SU-8 Structures Using UV Lithography and Megasonic-Enhanced Development
    Figura, D.
    Bartel, J.
    SENSORS, ACTUATORS, AND MICROSYSTEMS (GENERAL) - 216TH ECS MEETING, 2010, 25 (31): : 29 - 35
  • [36] Using megasonic development of SU-8 to yield ultra-high aspect ratio microstructures with UV lithography
    Williams, JD
    Wang, W
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2004, 10 (10): : 694 - 698
  • [37] Using megasonic development of SU-8 to yield ultra-high aspect ratio microstructures with UV lithography
    J. D. Williams
    W. Wang
    Microsystem Technologies, 2004, 10 : 694 - 698
  • [38] Process optimisation for compact, high aspect ratio SU-8 microstructures using x-ray lithography
    Vora, KD
    Shew, DY
    Harvey, EC
    Hayes, JP
    Peele, AG
    DEVICE AND PROCESS TECHNOLOGIES FOR MICROELECTRONICS, MEMS, AND PHOTONICS IV, 2006, 6037
  • [39] Manufacturing tolerances for UV LIGA using SU-8 resist
    Lawes, RA
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2005, 15 (11) : 2198 - 2203
  • [40] Complex three-dimensional high aspect ratio microfluidic network manufactured in combined PerMX dry-resist and SU-8 technology
    Meier, Robert Ch.
    Badilita, Vlad
    Brunne, Jens
    Wallrabe, Ulrike
    Korvink, Jan G.
    BIOMICROFLUIDICS, 2011, 5 (03):
12345