Fabrications of high-aspect ratio microstructure on metallic substrate using SU-8 resist

被引：0
|
作者：
Liu, JQ [1 ]
Cai, BC [1 ]
Zhu, J [1 ]
Ding, GP [1 ]
Zhao, XL [1 ]
Yang, CS [1 ]
Chen, D [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Thin Film & Microfabricat Key Lab State Educ Mini, Informat Storage Res Ctr, Shanghai 200030, Peoples R China
来源：
MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY AND DEVICES | 2001年 / 4601卷
关键词：
UV-LIGA; SU-8; high aspect ratio; metallic substrate; NMMS;
D O I：
10.1117/12.444698
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
SU-8 is a negative, epoxy type, near-UV photoresist. The resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications. The adhesion of the SU-8 resist with the metallic substrate is very poor, but it is necessary to overcome this shortcoming for providing low-cost LIGA-type process in MEMS applications. In this paper, several metallic films are used as the substrates. The Ti film with oxidation treatment is found to have the strongest adhesion to the resist. SU-8 resist has been proven to be very sensitive to process variations, so the experimental optimizing technique is used in the process. Using processing parameters as control factors, experiments are performed and results are evaluated. As the results being analyzed, a proposed fabrication process is derived from optimizing the control factors. The output structure has straight sidewall profile, fine line and space resolution. The aspect ratio is greater than 20.
引用
收藏
页码：200 / 204
页数：5
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