Study on the Influence of Temperature and Stress Field to PCB's Modal

被引：1
|
作者：
Luo, Qin [1 ]
Zhang, Sujuan [1 ]
Zhang, Xiao [1 ]
机构：
[1] Beijing Univ Aeronaut & Astronaut, Beijing 100083, Peoples R China
来源：
FRONTIERS OF MANUFACTURING AND DESIGN SCIENCE III, PTS 1 AND 2 | 2013年 / 271-272卷
关键词：
temperature field; stress field; PCB's modal;
D O I：
10.4028/www.scientific.net/AMM.271-272.1441
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
With the increasing integration of electronic products, the heat flux density is increasing. Research on the heat dissipation of the PCB attracts more attention. Temperature field of the electronic products always changes a lot, usually leading to a transient stress field in the PCB. Due to the transient temperature field and transient stress field, the PCB's modal changed. In this paper, the temperature field and the stress field are obtained to explain the reason of the change. The influence on PCB's modal caused by the temperature field and the stress field are analyzed, on the basis of PCB's thermal modal analysis, which provide a reference for the PCB design and modal analysis in the future.
引用
收藏
页码：1441 / 1445
页数：5
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