Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection

被引：28
作者：
Chen, Zhuo [1 ]
Luo, Tingbi [1 ]
Hang, Tao [1 ]
Li, Ming [1 ]
Hu, Anmin [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Key Lab Thin Film & Microfabricat Technol,Minist, Shanghai 200240, Peoples R China
来源：
ECS SOLID STATE LETTERS | 2012年 / 1卷 / 01期
基金：
中国国家自然科学基金;
关键词：
MECHANICAL-PROPERTIES; CU; CREEP;
D O I：
10.1149/2.010201ssl
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This paper reports a low-temperature solid state bonding method for potential use in advanced electronic packaging, especially in 3D integration applications. Electrodeposited Ni micro cones with an Au anti-oxidation layer were fabricated and utilized to bond with Sn-capped Cu bumps with the help of appropriate temperature and pressure. Bonding joints were shear tested to evaluate the joint strength of samples bonded at each pressure, with results comparable to reflow soldering. Microscopic observation showed sufficient insertion between Sn and cone-structured Ni, as well as atomic scale bonding between two metals. (C) 2012 The Electrochemical Society. All rights reserved.
引用
收藏
页码：P7 / P10
页数：4
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