Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface

被引：3

作者：

Shi Ji-Peng ^{[1
]}

Yang Fang-Zu ^{[1
]}

Tian Zhong-Qun ^{[1
]}

Zhou Shao-Min ^{[1
]}

机构：

[1] Xiamen Univ, State Key Lab Phys Chem Solid Surfaces, Coll Chem & Chem Engn, Xiamen 361005, Fujian Province, Peoples R China

来源：

ACTA PHYSICO-CHIMICA SINICA | 2013年 / 29卷 / 12期

基金：

中国国家自然科学基金;

关键词：

Cu-Sn alloy; Electrocrystallization; Cyclic voltammetry; Chronoamperometry; DIFFUSION-CONTROLLED GROWTH; ELECTROCHEMICAL NUCLEATION; POLYCRYSTALLINE; ADDITIVES; TARTRATE; NICKEL; ZINC; TIN; NI;

D O I：

10.3866/PKU.WHXB201310092

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The co-deposition and electrocrystallization of Cu-Sn alloy in a weak acidic citrate bath were studied by linear sweep voltammetry (LSV), cyclic voltammetry (CV), and chronoamperometry. The Scharifker-Hill (SH) theory model and Heerman-Tarallo (HT) theory model were applied to analyze the chronoamperometry data. The results show that the Cu-Sn alloy co-deposited on copper electrode, following instantaneous nucleation with three-dimensional (3D) growth under diffusion control. The kinetic parameters were obtained using the HT model. As the step potential shifted from -0.80 to -0.85 V, the nucleation rate constant (A) increased from 20.19 to 177.67 s(-1), the density of active nucleation sites (N-0) increased from 6.10x10(5) to 1.42x10(6) cm(-2), and the diffusion coefficient (D) was (6.13+/-0.62) x 10(-6) cm(2).s(-1).

引用

页码：2579 / U131

页数：10

共 29 条

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[2]

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