Surface and interface stress effects on the growth of thin films

被引：16

作者：

Cammarata, RC

机构：

[1] Dept. of Mat. Sci. and Engineering, Johns Hopkins University, Baltimore

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1997年 / 26卷 / 09期

关键词：

critical thickness; interface stress; surface stress; thin film;

D O I：

10.1007/s11664-997-0232-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Surface and interface stresses represent the work per unit area to stretch the surface of a solid. These types of stresses are discussed, emphasizing their relevance to thin film growth. In particular, the influence of these parameters on the critical thickness for epitaxy and for intrinsic thin film stress generation are considered.

引用

页码：966 / 968

页数：3

共 8 条

[1] THE INTERNAL-STRESS IN THIN SILVER, COPPER AND GOLD-FILMS [J].