Thermal conductivity of composites made of wastes of wood and expanded polystyrene

被引:30
作者
Agoua, Eusebe [1 ]
Allognon-Houessou, Elisabeth [2 ]
Adjovi, Edmond [2 ]
Togbedji, Bovis [3 ]
机构
[1] Ecole Polytech Abomey Calavi, Lab Energet & Mecan Appl, Abomey Calavi, Benin
[2] Ecole Polytech Abomey Calavi, Lab Energet & Mecan Appl, Cotonou, Benin
[3] Ecole Polytech Abomey Calavi, Lab Energet & Mecan Appl, Cotonou, Benin
关键词
Polystyrene; Wood; Composite material; Granular composition; Thermal conductivity; Waste recycling; Sawdusts seriated; Environmental protection; MEDIUM DENSITY FIBERBOARD;
D O I
10.1016/j.conbuildmat.2012.12.016
中图分类号
TU [建筑科学];
学科分类号
0813 ;
摘要
In the present work, a possibility of recycling sediments of woods and polystyrene packing remove from service in view to produce composite materials of wood has been examined. The composite materials consist in that chips or sawdusts of wood sorted in particles of varied dimension and mixed according to a granular composition well defined. The different components are assembled with glue obtained from polystyrene of packing dissolves in a solvent. The thermal conductivity lambda determined for this type of composite shows that this one can be used in the realization of the partitions and suspended ceilings. (C) 2013 Elsevier Ltd. All rights reserved.
引用
收藏
页码:557 / 562
页数:6
相关论文
共 12 条
[1]  
Allognon E, 2005, METHODE CHAMP THERMI, P3
[2]  
Allognon E, 2007, THESIS U ABOMEY CALA, P2
[3]   Softwood bark pyrolysis oil-PF resols part 1. Resin synthesis and OSB mechanical properties [J].
Amen-Chen, C ;
Riedl, B ;
Wang, XM ;
Roy, C .
HOLZFORSCHUNG, 2002, 56 (02) :167-175
[4]  
Boquillon N, 2001, ETUDE POLYM OBTENUS, P117
[5]   ADHESIVE FIBER INTERACTION IN MEDIUM DENSITY FIBERBOARD [J].
DONALDSON, LA ;
LOMAX, TD .
WOOD SCIENCE AND TECHNOLOGY, 1989, 23 (04) :371-380
[6]   Urea-formaldehyde (UF) adhesive resins for wood [J].
Dunky, M .
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 1998, 18 (02) :95-107
[7]  
Hachmi M, 2009, FORET MEDITERRANEENN, VXXX, P257
[8]  
KAWAI S, 1986, MOKUZAI GAKKAISHI, V32, P324
[9]   Application of cure-accelerated phenol-formaldehyde (PF) adhesives for three-layer medium density fiberboard (MDF) manufacture [J].
Park, BD ;
Riedl, B ;
Hsu, EW ;
Shields, J .
WOOD SCIENCE AND TECHNOLOGY, 2001, 35 (04) :311-323
[10]  
Racher P, 1996, STRUCTURE BOIS ETATS