Reaction of implanted n isotope with SiO2 near Si3N4-Film and SiO2-substrate interface

被引:2
作者
Shinde, Ninad
Matsunami, Noriaki [1 ]
Fukuoka, Osamu
Tazawa, Masato
Shimura, Tetsuo
Chimi, Yasuhiro
Sataka, Masao
机构
[1] Nagoya Univ, Div Energy Sci, EcoTopia Sci Inst, Chikusa Ku, Nagoya, Aichi 4648603, Japan
[2] Natl Inst Adv Ind Sci & Technol, Nagoya, Aichi 4638560, Japan
[3] Nagoya Univ, NanoMat Sci Div, EcoTopia Sci Inst, Chikusa Ku, Nagoya, Aichi 4648603, Japan
[4] Japan Atom Energy Agcy, Dept Mat Sci, Ibaraki 3191195, Japan
关键词
nitrogen 15-isotope-rich film; silicon-nitride; implantation; interface reaction; Rutherford backscattering spectroscopy; nuclear reaction analysis; optical absorption;
D O I
10.3327/jnst.43.382
中图分类号
TL [原子能技术]; O571 [原子核物理学];
学科分类号
0827 ; 082701 ;
摘要
We have investigated 100 keV N-15 (90% enriched) implantation effects on Si3N4 films on SiO2-glass-substrate. The Si3N4 films were prepared by using reactive RF-magnetron-sputter-deposition method in N-2 (natural isotope abundance) gas at room temperature. The composition and film thickness were measured by Rutherford backscattering spectroscopy (RBS) and optical absorption spectroscopy. The RBS and optical absorption spectroscopy show increase in the film thickness with the stoichiometric composition, by N-15 ion implantation. These results and depth distribution of the implanted N-15, which is obtained by nuclear reaction analysis (NRA), lead to formation of Si-3 N-15(4) film (embedded isotope rich nitride film). Enrichment of N-15 in the grown silicon-nitride film is estimated to be similar to 70%.
引用
收藏
页码:382 / 385
页数:4
相关论文
共 50 条
[41]   DIELECTRIC PROPERTIES OF POROUS Si3N4-SiO2-BN COMPOSITES [J].
Sun, Yinbao ;
Zhang, Yumin ;
Li, Dihong ;
Han, Jiecai .
INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2009, 23 (6-7) :1879-1884
[42]   Charge trap analysis of nanolayer Si3N4 and SiO2 by electron irradiation assisted photoelectron emission [J].
Dekhtyar, Yuri ;
Enichek, Gennady ;
Romanova, Marina ;
Ben Schmidt ;
Vilken, Aleksandr ;
Yager, Tom ;
Zaslavski, Aleksandr .
PHYSICA B-CONDENSED MATTER, 2020, 586
[43]   Infrared interference coating by use of Si3N4 and SiO2 films with ion-assisted deposition [J].
Lee, Cheng-Chung ;
Ku, Shih-Liang .
APPLIED OPTICS, 2010, 49 (03) :437-441
[44]   Selective wet etching of Si3N4/SiO2 in phosphoric acid with the addition of fluoride and silicic compounds [J].
Seo, Dongwan ;
Bae, Jin Sung ;
Oh, Eunseok ;
Kim, Solbaro ;
Lim, Sangwoo .
MICROELECTRONIC ENGINEERING, 2014, 118 :66-71
[45]   Fracture behavior of Si3N4/SiC-chopped-fiber composites with SiO2 at the grain boundary [J].
Pezzotti, G ;
Hashimoto, T ;
Nishida, T ;
Sakai, M .
JOURNAL OF THE CERAMIC SOCIETY OF JAPAN, 1995, 103 (12) :1228-1232
[46]   Mechanism of selective Si3N4 etching over SiO2 in hydrogen-containing fluorocarbon plasma [J].
Chen, Lele ;
Xu, Linda ;
Li, Dongxia ;
Lin, Bill .
MICROELECTRONIC ENGINEERING, 2009, 86 (11) :2354-2357
[47]   Plasma atomic layer etching of SiO2 and Si3N4 using low global warming hexafluoropropene [J].
Choi, Minsuk ;
Lee, Hyeongwu ;
Jung, Taeseok ;
Jeon, Minsung ;
Chae, Heeyeop .
JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2025, 86 (06) :501-511
[48]   Charge transport-accumulation in multilayer structures with Si3N4 and thick(5.5 nm) SiO2 [J].
Novikov, Yu. N. .
JOURNAL OF APPLIED PHYSICS, 2015, 117 (15)
[49]   Mechanical properties of SiO2 and Si3N4 coatings:: a BAM/NIST co-operative project [J].
Beck, U ;
Smith, DT ;
Reiners, G ;
Dapkunas, SJ .
THIN SOLID FILMS, 1998, 332 (1-2) :164-171
[50]   Effects of post-deposition annealing on chemical composition of SiNx film in SiO2/SiNx/SiO2/Si stacked structure [J].
Sakata, Tomohiro ;
Ogawa, Shingo ;
Inoue, Keiko ;
Shimizu, Yumiko ;
Tanahashi, Yusaku .
SURFACE AND INTERFACE ANALYSIS, 2022, 54 (06) :661-666