Reaction of implanted n isotope with SiO2 near Si3N4-Film and SiO2-substrate interface

被引:2
|
作者
Shinde, Ninad
Matsunami, Noriaki [1 ]
Fukuoka, Osamu
Tazawa, Masato
Shimura, Tetsuo
Chimi, Yasuhiro
Sataka, Masao
机构
[1] Nagoya Univ, Div Energy Sci, EcoTopia Sci Inst, Chikusa Ku, Nagoya, Aichi 4648603, Japan
[2] Natl Inst Adv Ind Sci & Technol, Nagoya, Aichi 4638560, Japan
[3] Nagoya Univ, NanoMat Sci Div, EcoTopia Sci Inst, Chikusa Ku, Nagoya, Aichi 4648603, Japan
[4] Japan Atom Energy Agcy, Dept Mat Sci, Ibaraki 3191195, Japan
关键词
nitrogen 15-isotope-rich film; silicon-nitride; implantation; interface reaction; Rutherford backscattering spectroscopy; nuclear reaction analysis; optical absorption;
D O I
10.3327/jnst.43.382
中图分类号
TL [原子能技术]; O571 [原子核物理学];
学科分类号
0827 ; 082701 ;
摘要
We have investigated 100 keV N-15 (90% enriched) implantation effects on Si3N4 films on SiO2-glass-substrate. The Si3N4 films were prepared by using reactive RF-magnetron-sputter-deposition method in N-2 (natural isotope abundance) gas at room temperature. The composition and film thickness were measured by Rutherford backscattering spectroscopy (RBS) and optical absorption spectroscopy. The RBS and optical absorption spectroscopy show increase in the film thickness with the stoichiometric composition, by N-15 ion implantation. These results and depth distribution of the implanted N-15, which is obtained by nuclear reaction analysis (NRA), lead to formation of Si-3 N-15(4) film (embedded isotope rich nitride film). Enrichment of N-15 in the grown silicon-nitride film is estimated to be similar to 70%.
引用
收藏
页码:382 / 385
页数:4
相关论文
共 50 条
  • [1] Analysis of N isotope depth profiles in search for reaction of implanted nitrogen with substrate near Si3N4-nitride-film and SiO2-glass-substrate interface
    Matsunami, N.
    murase, T.
    Tazawa, M.
    Ninad, S.
    Fukuoka, O.
    Shimura, T.
    Sataka, M.
    Chimi, Y.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2006, 249 : 185 - 188
  • [2] Formation of SiO2/Si3N4/SiO2 Positive and Negative Electrets on a Silicon Substrate
    Crain, Mark M.
    McNamara, Shamus
    Depuy, Gail
    Keynton, Robert S.
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2016, 25 (06) : 1041 - 1049
  • [3] Analysis of depth redistribution of implanted Fe near SiO2/Si interface
    Hoshino, Y.
    Yokoyama, A.
    Yachida, G.
    Nakata, J.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2013, 314 : 140 - 143
  • [4] Evidence of C migration in the SiO2 to the SiO2/Si interface of C-implanted structures
    Ribas, E.
    Maltez, R. L.
    THIN SOLID FILMS, 2021, 730
  • [5] Effect of SiO2 Layer Thickness on SiO2/Si3N4 Multilayered Thin Films
    Huang, Ziming
    Duan, Jiaqi
    Li, Minghan
    Ma, Yanping
    Jiang, Hong
    COATINGS, 2024, 14 (07)
  • [6] Optical and electronic properties of Si3N4 and α-SiO2
    Kresse, G.
    Marsman, M.
    Hintzsche, L. E.
    Flage-Larsen, E.
    PHYSICAL REVIEW B, 2012, 85 (04):
  • [7] Stabilization of positive charge in SiO2/Si3N4 electrets
    Leonov, V.
    Fiorini, P.
    Van Hoof, C.
    IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2006, 13 (05) : 1049 - 1056
  • [8] Charge Retention in a Patterned SiO2/Si3N4 Electret
    Leonov, Vladimir
    van Schaijk, Rob
    Van Hoof, Chris
    IEEE SENSORS JOURNAL, 2013, 13 (09) : 3369 - 3376
  • [9] Wettability and infiltration of molten Si on SiO2 substrate containing porous Si3N4 coating: Influence of α-Si3N4 coating and β-Si3N4 coating
    Wang, Qinghu
    Zhang, Xiaowei
    Yang, Shengzhe
    He, Gang
    Li, Jianqiang
    Liang, Xiong
    Pan, Liping
    Li, Yawei
    Yang, Zengchao
    Chen, Yixiang
    Li, Jiangtao
    Jiang, Lei
    SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2024, 277
  • [10] OPTICAL-ABSORPTION IN SILICON-OXIDE FILM NEAR THE SIO2/SI INTERFACE
    HAGA, T
    MIYATA, N
    MORIKI, K
    FUJISAWA, M
    KANEOKA, T
    HIRAYAMA, M
    MATSUKAWA, T
    HATTORI, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1990, 29 (12): : L2398 - L2400