Active control of boundary conditions for dynamic thermal characterization of electronic components

被引：4

作者：

Janicki, Marcin ^{[1
]}

Torzewicz, Tomasz ^{[1
]}

Kulesza, Zbigniew ^{[1
]}

Napieralski, Andrzej ^{[1
]}

机构：

[1] Tech Univ Lodz, Dept Microelect & Comp Sci, PL-90924 Lodz, Poland

来源：

MICROELECTRONICS JOURNAL | 2013年 / 44卷 / 11期

关键词：

Dynamic thermal characterization of electronic components; Active stabilization of boundary conditions;

D O I：

10.1016/j.mejo.2012.09.002

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a practical realization of the system for the active control of boundary conditions during the dynamic thermal characterization of electronic components. The control of boundary conditions is exercised by the dual cold plate cooling assembly equipped with Peltier thermo-electric modules and an appropriate control circuit. Additionally, a tensometer bridge is used to assure the parallel alignment of surfaces and to adjust the contact thermal resistance between particular layers. The operation of the entire control system is illustrated based on a practical example where Peltier module currents are adjusted in real time so as to impose isothermal or constant heat flux boundary conditions on a power diode package surface during measurements performed with time varying power dissipation in the device. (C) 2012 Elsevier Ltd. All rights reserved.

引用

页码：1019 / 1024

页数：6

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