The effect of hydrostatic pressure on the shear deformation of Cu symmetric tilt interfaces

被引:14
作者
Tiwari, Shreevant [1 ]
Tucker, Garritt J. [3 ]
McDowell, David L. [1 ,2 ]
机构
[1] Georgia Inst Technol, Sch Mat Sci & Engn, 771 Ferst Dr NE, Atlanta, GA 30332 USA
[2] Georgia Inst Technol, GW Woodruff Sch Mech Engn, 801 Ferst Dr NE, Atlanta, GA 30332 USA
[3] Colorado Sch Mines, Dept Mech Engn, Golden, CO 80401 USA
基金
美国国家科学基金会;
关键词
Molecular dynamics; Grain boundaries; Grain boundary engineering; Pressure; GRAIN-BOUNDARY MOTION; DISLOCATION NUCLEATION; MECHANICAL-BEHAVIOR; MEDIATED PLASTICITY; CUBIC METALS; FREE-VOLUME; COPPER; MIGRATION; STRENGTH; ALUMINUM;
D O I
10.1016/j.ijplas.2019.02.001
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
The effect of hydrostatic pressure on the shear deformation behavior of 10 Cu symmetric tilt interfaces has been investigated in the athermal deformation regime (10 K) using molecular dynamics simulations. Cu bicrystals were deformed under shear with a superimposed hydrostatic stress, until initial yield. For most interfaces, the shear strength increased with increasing compressive hydrostatic pressure. However, for the Sigma 9{221} and Sigma 5{210} interfaces, this trend was reversed. Neither the sign nor the magnitude of the pressure-induced elevation in shear strength was found to correlate with interface structure or particular deformation mechanism(s). The findings suggest that in general, metrics of interfacial excess volume and dilatation cannot reliably predict the pressure-sensitivity of shear strength; however, for interfaces containing the E structural unit, the annihilation of free volume appears to correlate well with the observed pressure-sensitivity.
引用
收藏
页码:87 / 104
页数:18
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